Composé thermique TG-30
Composé thermique TG-30
SKU:CL-O023-GROSGM-A
TG-30 est un composé thermique haut de gamme pour des performances de refroidissement de haut niveau, conçu pour réduire efficacement les températures du processeur.
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Conception
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Spécification
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Téléchargement
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Vidéos explicatives
The thermal compound contains diamond powder, which would provide a thermal conductivity of 4.5 W/m-k that could fulfill the user’s primary needs.
Thermaltake’s specially formulated thermal compound fits perfectly with the honeycomb stencil, which provides an easier way to apply your thermal compound for a neat and well-covered surface that fits all CPUs.
*The viscosity number of TG series is the optimized number
based on the testing result from Thermaltake.
This thermal compound application kit includes a set of easily-applied tools for immediate use.
The high-quality thermal compound provides a longer lifespan of eliminating dry-out or cracking while in use.
Non-electrical conductive compound ensures better safety measures for you and your system.
Product Specifications
| P/N | CL-O023-GROSGM-A |
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