TG-30 Thermal Compound
TG-30 Thermal Compound
SKU:CL-O023-GROSGM-A
-
Design
-
Specification
-
Download
-
How-to Videos
The thermal compound contains diamond powder, which would provide a thermal conductivity of 4.5 W/m-k that could fulfill the user’s primary needs.
Thermaltake’s specially formulated thermal compound fits perfectly with the honeycomb stencil, which provides an easier way to apply your thermal compound for a neat and well-covered surface that fits all CPUs.
*The viscosity number of TG series is the optimized number
based on the testing result from Thermaltake.
This thermal compound application kit includes a set of easily-applied tools for immediate use.
The high-quality thermal compound provides a longer lifespan of eliminating dry-out or cracking while in use.
Non-electrical conductive compound ensures better safety measures for you and your system.
P/N | CL-O023-GROSGM-A |
---|---|
Thermal Conductivity | 4.5 W/m-k |
Color | Gray |
Density | 2.55 g/cm³ |
Viscosity | 76 Pa-s |
Thermal Impedance | 0.185°C -in²/W |
Weight | 4g |
User Manual
- File Name
- Description
- Size
- Version
- Release Date
Drivers & Software
- File Name
- Description
- Size
- Version
- Release Date