TG-30 Thermal Compound
TG-30 Thermal Compound
SKU:CL-O023-GROSGM-A
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TG-30 is a premium thermal compound for high standard cooling performance designed to lower CPU temperatures effectively.
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Design
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Specification
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The thermal compound contains diamond powder, which would provide a thermal conductivity of 4.5 W/m-k that could fulfill the user’s primary needs.
Thermaltake’s specially formulated thermal compound fits perfectly with the honeycomb stencil, which provides an easier way to apply your thermal compound for a neat and well-covered surface that fits all CPUs.
*The viscosity number of TG series is the optimized number
based on the testing result from Thermaltake.
This thermal compound application kit includes a set of easily-applied tools for immediate use.
The high-quality thermal compound provides a longer lifespan of eliminating dry-out or cracking while in use.
Non-electrical conductive compound ensures better safety measures for you and your system.
| P/N | CL-O023-GROSGM-A |
|---|---|
| Thermal Conductivity | 4.5 W/m-k |
| Color | Gray |
| Density | 2.55 g/cm³ |
| Viscosity | 76 Pa-s |
| Thermal Impedance | 0.185°C -in²/W |
| Weight | 4g |
