This syringe is the improved version preventing the compound from becoming stuck and requires less force.

Features Application for CPU,Chipset and Graphic card Made with 99.9% pure micronized silver High-Density.Over 88% thermally conductive content by weight Controlled Triple-Phase Viscosity Not Electrically Conductive Easy to apply. Just use a clean plastic and spread on Absolute Stability. Will not separate, run, migrate, or bleed

Detail Information
(Click image for enlarged View)	The Arctic Silver 5 arrives more thicker and Arctic Silver claims that the thickness will improve the spread of the compound and effectively fill in the microscopic valleys between die and CPU		Package View

Detail Specifications
P/N	A2150			Material	Silver,Boron Nitride,Zinc Oxide, Aluminum Oxide, Polyol Ester.
Color	Gray			Weight	3.5g
Thermal Conductivity	>8.7w/mk			Operation Temperature	-50C ~ 130C

We do not recommend using Arctic Silver 5 on the older slot type Intel Xeon processors with large multiple square inch CPU to heatsink interfaces. The huge contact area and large gaps between the processor and the heatsink require a thermal pad or thick mesh-reinforced paste. Arctic Silver 5 can be used on socket type Xeons without a problem.